Semiconductor AI Vision Inspection

Semiconductor AI Vision Inspection

AI vision & precision metrology for semi quality

Covering wafer, packaging and device inspection
Build full-process vision inspection solutions for semiconductors

Jiexiang serves wafers, bare dies, packaged chips, discrete & power semiconductors, substrates and key components. Combining high-res imaging, multi-light & multi-angle vision, AI defect recognition, OCR and precision metrology, it delivers vision inspection for appearance, dimension, offset, structural integrity and marking. In-line testing, quick changeover and data traceability improve inspection efficiency, defect stability and quality control.

Pain Points

01
Faint tiny defects bring high recognition challenges
Faint tiny defects bring high recognition challenges

Wafers, dies and packaged devices have tiny low-contrast defects like cracks, chipping, scratches, contamination and glue overflow. Some resemble normal textures, causing missed and false detection by traditional methods.

02
Complex materials and surfaces make consistent imaging hard
Complex materials and surfaces make consistent imaging hard

Coexisting high-reflection, low-contrast, transparent and multi-material surfaces. Single light and fixed imaging fail to reveal defects steadily, raising requirements for optics and vision algorithms.

03
Multi products & defect specs, poor inspection adaptability
Multi products & defect specs, poor inspection adaptability

Diverse package forms, specs and defect criteria. Frequent model switching slows traditional inspection setup with long cycles and complex parameter tuning.

04
High speed & high precision complicate quality data closed-loop.
High speed & high precision complicate quality data closed-loop.

Semiconductor in-line inspection demands high speed, accuracy and repeatability. Disconnected images, defect results and product data impede quality analysis and traceability.

App Scen

半导体应用场景
Chip Pack & Finished Insp
  • Molded Chip
  • BGA, QFN, SOP Package Devices
  • Pins & Solder Balls
  • Chip Package Finished Part
  • Advanced Packaging Products
Substrate & Key Comp Insp
  • Lead Frame
  • IC Packaging Substrate
  • Ceramic Substrate
  • Chip Tray & Carrier
  • Semi Interconnect & Support Parts
Wafer & Bare Chip Insp
  • Wafer
  • Bare Die
  • Diced Chip
  • Wafer Surface & Edge
  • Wafer Mark & Pattern Zone
Discrete & Power Semi Insp
  • Diodes & Transistors
  • MOSFETs & IGBTs
  • Rectifiers
  • Power Devices
  • Power Semi Modules
Chip Pack & Finished Insp
  • Molded Chip
  • BGA, QFN, SOP Package Devices
  • Pins & Solder Balls
  • Chip Package Finished Part
  • Advanced Packaging Products
Substrate & Key Comp Insp
  • Lead Frame
  • IC Packaging Substrate
  • Ceramic Substrate
  • Chip Tray & Carrier
  • Semi Interconnect & Support Parts
Wafer & Bare Chip Insp
  • Wafer
  • Bare Die
  • Diced Chip
  • Wafer Surface & Edge
  • Wafer Mark & Pattern Zone
Discrete & Power Semi Insp
  • Diodes & Transistors
  • MOSFETs & IGBTs
  • Rectifiers
  • Power Devices
  • Power Semi Modules

Core Advantages

Multi-source imaging & micro-defect inspection capability
Multi-source imaging & micro-defect inspection capability

Combines high-res imaging, multi-light and multi-angle vision to enhance faint micro-defects, detecting cracks, chipping, scratches, contamination and damage.

Vision imaging capability for complex materials
Vision imaging capability for complex materials

Optical design for high-reflection, low-contrast, transparent and multi-material scenes. Coordinated light, lens, angle and algorithms boost defect visibility and inspection stability.

AI algorithm & flexible adaptation capability
AI algorithm & flexible adaptation capability

Combining traditional vision and deep learning AI, it manages multi-product recipes, enables quick changeover and continuous model optimization for varied packages, specs and criteria.

High-speed inline insp & data traceability
High-speed inline insp & data traceability

Balancing throughput, accuracy and stability. It links product codes, images, defects and parameters, connects with MES/QMS for query, analysis and traceability.

Relevant Cases

Screw fastening machine

Screw fastening machine

Automatic screw fastener compatible with two junction box models. Four fastening electric guns control torque for torx security screws. Cycle time: 24s per part. Quick changeover via fixtures & programs, ready for production line integration.

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High-precision vacuum tester

High-precision vacuum tester

Custom non-standard airtight vacuum test platform. Integrated vacuuming, pressure stabilization & leak detection identifies micro leaks accurately with traceable data to guarantee sealing quality.Custom non-standard airtight vacuum test platform. Integrated vacuuming, pressure stabilization & leak detection identifies micro leaks accurately with traceable data to guarantee sealing quality.

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Screen laminating machine

Screen laminating machine

Custom high-precision laminating solution for precise alignment and pressing of cover glass and displays. Compatible with multiple lamination processes to eliminate bubbles and misalignment for automated screen assembly.

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Fully automatic screw locking machine

Fully automatic screw locking machine

Integrates automatic screw feeding, precise fastening and intelligent inspection. Customizable for non-standard applications, it automates the full screw locking process to cut costs, boost efficiency and secure assembly quality.

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E-price tag inner screen assembly machine

E-price tag inner screen assembly machine

Custom-built for electronic price tags. It automates inner screen loading, alignment, bonding and fastening, ensuring assembly precision and production yield.

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Panel appearance inspection machine

Panel appearance inspection machine

Smart machine vision inspection efficiently identifies various panel surface defects, replacing manual visual check with stable, consistent detection for panel quality control.

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Integrated loading machine for screen printing, film peeling & inkjet marking

Integrated loading machine for screen printing, film peeling & inkjet marking

Combines loading, film peeling, screen printing and inkjet marking. One machine replaces multiple standalone units for stable continuous processing, supporting varied workpieces to automate surface treatment.

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Inquiry
Hotline 180 3611 2701