Jiexiang serves wafers, bare dies, packaged chips, discrete & power semiconductors, substrates and key components. Combining high-res imaging, multi-light & multi-angle vision, AI defect recognition, OCR and precision metrology, it delivers vision inspection for appearance, dimension, offset, structural integrity and marking. In-line testing, quick changeover and data traceability improve inspection efficiency, defect stability and quality control.
Combines high-res imaging, multi-light and multi-angle vision to enhance faint micro-defects, detecting cracks, chipping, scratches, contamination and damage.
Optical design for high-reflection, low-contrast, transparent and multi-material scenes. Coordinated light, lens, angle and algorithms boost defect visibility and inspection stability.
Combining traditional vision and deep learning AI, it manages multi-product recipes, enables quick changeover and continuous model optimization for varied packages, specs and criteria.
Balancing throughput, accuracy and stability. It links product codes, images, defects and parameters, connects with MES/QMS for query, analysis and traceability.